Tecdia Chip Capacitors are normally constructed as square chips for single values and binary capacitor arrays, and in rectangular shapes for capacitor row arrays and custom designs. Tecdia uses variations in chip thickness (by lapping), as well as electrode/ceramic size and dielectric constant to construct capacitors. This permits a broad range of capacitance values to be manufactured with various form factors and designs.

Tecdia’s surface-mount dielectric varactors are made with a unique Tecdia proprietary voltage controllable dielectric and are designed for controlling impedance in a wide variety of applications operational up to millimeter-wave frequencies.  Some common applications for the varactor are Tunable Phase Shifters, Tunable Matching Networks, Tunable Filters, and Voltage Controlled Oscillators (VCOs).  Besides a selection of standard part numbers, we support custom varactor requests and can tailor capacitance, size, metallization, and other specifications as requested.  Please contact Tecdia for samples requests and questions regarding dielectric varactors.

Wire bondable, high aspect ratio chip capacitors for transistor impedance pre-matching and other applications.

Wire bondable, multiple pad capacitors for prototyping or precision capacitance tuning.

Wire bondable OR flip chip (SMT) style die attach AC coupling capacitors.

Wire bondable row/array capacitors for decoupling multiple channels of a MMIC or other die.

Chip resistors for impedance matching and noise filtering applications.

Combines a capacitor and a resistor on a single ceramic chip to help economize space within devices and reduce component count.

Ceramic Ground Blocks are customizable conductive shims ideal for application within micro-assemblies in both optical and microwave industries.

Tecdia’s Thin Film Substrates technologies combine over 40 years of experience in ceramics, machining, wafer processing, and thin film metallization techniques into one group that specializes in build-to-print thin film metalized ceramic substrates. Features such as fine patterns, electrical wraps, thin film resistors and pre-deposited AuSn are all specialized for miniaturized high-speed communication devices.